Fakultät EuI Institut für Aufbau- und Verbindungstechnik der Elektronik / Zentrum für mikrotechnische Produktion
Materials for the 3D system integration „3D system integration and 3D technologies“Student Metrology Seminar / 05.07.2016 Topic: …
Dresden, Summer Term 2016 (NES)
Group: Number
Presenter: …
Contributors: …
Faculty EuI Electronic Packaging Laboratory (IAVT) / Center of Microtechnical Manufacturing (ZmP)
Summer Term 2016
3D system integration and 3D technologies
Student Metrology Seminar
1.…
2.…
3.…
References
Outline
Outline
Slide 2
Faculty EuI Electronic Packaging Laboratory (IAVT) / Center of Microtechnical Manufacturing (ZmP)
Summer Term 2016
3D system integration and 3D technologies
Student Metrology Seminar
Slide 3